Manufacturers of precision cutting (Wafer Dicer / Dicing saw / Laser cutting), grinding and polishing machines for semiconductors applications and precision diamond abrasive tools (Dicing blades, grinding wheels and Polishing wheels / pads).
For more details, please refer site www.disco.co.jp
SVCS Process Innovation designs and manufacturers batch horizontal oxidation/diffusion and LPCVD furnaces as well as high purity gas delivery system for the semiconductor and photovoltaic industry.
For more details, please refer site www.svcs.cz
Hesse Mechatronics is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, ultrasonic Flip-Chip Bonders as well as special bonding tools for Electronic vehicle battery bonding applications.
For more details, please refer site www.hesse-mechatronics.com
Treskymanufacture manual and semi-automatic die bonder solutions for semiconductor, automotive and other industries.
For more details, please refer site www.tresky.com
Manufacturer and service operation specializing in the development, production and sale of products for the semiconductor industry in the backend area – e.g., Manual and semi-automatic - Wafer Mounter, Laminator, UV curing stations, as well as accessories such as frames, films, magazines.
For more details, please refer site www.powatec.com